|
广西师范大学学报(自然科学版) ›› 2014, Vol. 32 ›› Issue (2): 55-59.
陈东1,2, 刘诗斌1, 梁晋涛3
CHEN Dong1,2 , LIU Shi-bin1 , LIANG Jin-tao3
摘要: 四甲基氢氧化铵(TMAH)是一种在微机电系统加工中常用的硅湿法刻蚀剂。在对含有铝结构表面的硅器件进行湿法刻蚀时,需要在TMAH溶液中添加一定量的硅酸和氧化剂,以保护器件表面的金属铝,但这会降低硅表面的光洁度。本文在含硅酸的TMAH溶液中同时添加过硫酸铵和异丙醇2种物质,研究其对TMAH刻蚀作用的影响。研究结果表明,2种物质的协同作用能够显著提高硅刻蚀表面的光洁度。
中图分类号:
[1] BISWAS K, KAL S. Etch characteristics of KOH, TMAH and dual doped TMAH for bulk micromachining of silicon [J]. Microelectronics Journal, 2006, 37(6): 519-525. [2] 王涓, 孙岳明, 黄庆安, 等. 单晶硅各向异性湿法腐蚀机理的研究进展[J]. 化工时刊, 2004, 18(6):1-4. [3] 罗元, 李向东, 付红桥, 等. MEMS工艺中TMAH湿法刻蚀的研究[J]. 半导体光电, 2003, 24(2): 127-130. [4] 司俊杰, 马斌. 10% TMAH硅湿法腐蚀技术的研究[J]. 微细加工技术, 2004(3): 39-44. [5] FUJITSUKA N, HAMAGUCHI K, FUNABASHI H, et al. Silicon anisotropic etching without attacking aluminum with Si and oxidizing agent dissolved in TMAH solution[J]. Sensors and Actuators A, 2004, 114(2/3): 510-515. [6] MERLOS A, ACERO M, BAO M H, et al. TMAH/IPA anisotropic etching characteristics[J]. Sensors and Actuators A,1993, 37/38: 737-743. [7] ZUBEL I, KRAMKOWSKA M, ROLA K. Silicon anisotropic etching in TMAH solutions containing alcohol and surfactant additives[J]. Sensors and Actuators A, 2012, 178: 126-135. [8] PAL P, SATO K, SHIKIDA M, et al. Study of corner compensating structures and fabrication of various shapes of MEMS structures in pure and surfactant added TMAH[J]. Sensors and Actuators A, 2009, 154(2): 192-203. [9] KRAMKOWSKA M, ZUBEL I. Silicon anisotropic etching in KOH and TMAH with modified surface tension[J]. Procedia Chemistry, 2009,1(1): 774-777. [10] YANG Chii-rong, YANG Cheng-hao, CHEN Po-ying. Study on anisotropic silicon etching characteristics in various surfactant-added tetramethyl ammonium hydroxide water solutions[J]. J Micromech Microeng, 2005, 15(11): 2028-2037. [11] GOSÁLVEZ M A, TANG B, PAL P, et al. Orientation- and concentration-dependent surfactant adsorption on silicon in aqueous alkaline solutions:explaining the changes in the etch rate,roughness and undercutting for MEMS applications[J]. J Micromech Microeng, 2009, 19(12): 125011. [12] 杨宇平,王农. 几种醇溶液表面张力的测定与分析[J].广东化工,2010, 37(3): 180,215. |
No related articles found! |
|
版权所有 © 广西师范大学学报(自然科学版)编辑部 地址:广西桂林市三里店育才路15号 邮编:541004 电话:0773-5857325 E-mail: gxsdzkb@mailbox.gxnu.edu.cn 本系统由北京玛格泰克科技发展有限公司设计开发 |